Molecular Dynamics Simulation Group

This project investigates the atomic-scale mechanical properties of bimetallic copper-silver (Cu-Ag) nanowires using molecular dynamics simulations. By employing a specific Cu-Ag Embedded Atom Method (EAM) potential in LAMMPS, the study models the material's behavior under tensile loading and thermal stress. The primary objective is to analyze how the combination of copper and silver influences the nanowire's overall strength, ductility, and nanoscale defect formation. Ultimately, these insights will guide the development of highly durable bimetallic components for next-generation nanoelectronics and flexible sensors.

Team Working on this project

• Rakib Chowdhury

• Tanvir Ahasan