Heat sink is one of the most important passive cooling devices used to remove excess heat from compact electronic and engineering systems. In this study at Flow Physics and Thermofluids Modeling Group (https://www.aasmlab.org/.../flow-physics-and-thermofluids...), we investigate innovative fin geometries to improve thermal-hydraulic performance under forced convection.
The contours generated by the team demonstrate the temperature distribution, velocity streamlines, enthalpy variation, and pressure distribution for the base plate-fin heat sink. The temperature contour shows how heat is dissipated from the heated base and fin surfaces, while the velocity streamlines reveal airflow development through the fin channels and possible recirculation behavior.
The enthalpy contour represents thermal energy transport within the air domain, whereas the pressure distribution highlights the flow resistance developed across the heat sink. The work has been validated with existing literature.